Polartherm X-10 High Performance Thermal Compound - 2g

X-10

Ensure your system stays in top condition with our reliable and cost-effective thermal paste X-10—perfect for DIY PC builders, gamers, and professionals who demand cool, quiet, and stable operation under any workload.

Improved Performance

Experience the next level of cooling with the X-10 thermal compound, featuring an advanced formula in comparison with the X-8. With an improved silicone oil-based carrier material formula with a higher concentration of aluminum and zinc oxide powder, X-10 offers excellent thermal conductivity, low resistance, and significantly higher viscosity. This makes it ideal for processors with high heat output, ensuring durability and resistance to the pump-out effect.

Long-Term Stability Without Pump-Out Effect

The pump-out effect happens when thermal paste is squeezed out between the heat spreader and CPU cooler due to deformation from temperature changes. Materials like silicon and copper expand differently when heated, making this effect stronger, especially with copper coolers on GPUs. This effect is less noticeable at lower temperatures but becomes more pronounced at higher ones. X-10’s higher viscosity is essential for processors with higher heat output. Reapplication of thermal paste may be needed if CPU temperatures rise and clock speeds decrease.

Optimized for Air, Water Cooling and Beyond

The X-10 thermal compound combines excellent performance with user-friendly application, making it perfect for both beginners and experienced PC users. Designed for optimal heat transfer in both CPU and GPU cooling, X-10 excels in air and water-cooled systems and even in demanding professional conditions. Whether you’re maintaining your everyday PC or fine-tuning a high-end custom PC build, X-10 guarantees lower temperatures and consistent, reliable cooling.

Application Aids

• Direct Application: Apply the paste directly to the CPU without a spatula or applicator. Once the cooler is mounted, the pressure will evenly distribute the paste, filling in microscopic gaps.
• Spatula Method: Use the included spatula to spread the compound across the CPU surface. The cooler will compress the paste, ensuring full coverage even in the smallest areas.
• Applicator Method: Squeeze the paste directly onto the CPU heat spreader using the provided applicator, ensuring a thin, even layer. The cooler pressure will then fill any remaining gaps.