Deepcool CC560 V2 ARGB Mid Tower Case TG + AG620 ARGB CPU Cooler - Black

Deepcool  |  SKU 89161

Out of Stock

Warranty and Support

Warranty:

Returns: 14-day hassle-free exchanges and store credits, subject to terms and conditions outlined in our Returns Policy.

Description


CC560 ARGB Mid-Tower Case

The DeepCool CC560 ARGB Mid-Tower Case offers outstanding value with spacious component compatibility, a full-sized tempered glass window, and a total of four pre-installed A-RGB fans that gets any build started right.


ABUNDANT AIRFLOW PERFORMANCE
Well ventilated throughout the entire chassis, the CC560 ARGB sports an airflow front panel and a large mesh top panel to ensure fresh air is circulating.

PRIMED AND READY
A total of 4 pre-installed A-RGB fans delivers big airflow performance ensuring any system build is receiving top-notch cooling capacity. Quickly and easily customize the ARGB lighting effect with the built-in LED control button on the I/O panel or through a 5V header for motherboard synchronization.

WIDE COOLING SUPPORT

Enough space to support high-performance AIO liquid coolers with room for 360mm radiators in front or 240mm on top. Cooling fan support for up to 6x 120mm or 4x 140mm.


COMPATIBILITY

  • Max CPU Cooler Height: 163mm
  • Max GPU Length: 370mm
  • Max PSU Length: 170mm


STORAGE SOLUTIONS

Install up to 2x 2.5” SSDs directly on the backplate and 2x 3.5” HDDs underneath the shroud in a removeable drive cage for adjustability.


FRONT I/O PANEL

Features USB 3.0, USB 2.0, and a combo audio jack, and a custom configured LED control button to change preset lighting effects on the four pre-installed ARGB fans..

AG620 ARGB Dual-Tower CPU Cooler with 260W TDP

The DeepCool AG620 ARGB is a dual-tower 120mm CPU cooler that boasts impressive 260W cooling power performance that's been stripped down and optimized for terrific efficiency throughout.


SUBSTANTIAL COOLING POWER

Keep things cool with up to 260W of heat dissipation power to ensure your system is performing at its peak without a sweat.


BALANCED BIDIRECTIONAL HEAT PIPE TECHNOLOGY

By optimizing the internal capillary structure and injecting a precise amount of liquid, the heat pipe achieves the best heat dissipation performance regardless of whether the cooler is in a vertical or horizontal case. This perfect ratio facilitates a highly efficient phase change throughout the heat pipe and achieves lower thermal resistance over a wide TDP range.

HIGH EFFICIENCY FANS

Find your optimal balance with automatic PWM support for full performance under load to silent efficiency at idle.


MATRIX FINS ARRAY

High-quality aluminum fins on the heat sink are densely stacked for ideal heat dissipation and which also features a unique "checkerboard" design aesthetic.


SIMPLE AND SECURE

The included all-metal mounting brackets support both Intel and AMD platforms with an easy five-step installation process that maintains great contact pressure.

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